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25.11.2025
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OKI Launches Projection Assembly SystemTM in Southeast Asia
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OKI (TOKYO: 6703) launched its Projection Assembly SystemTM (Note 1) in Thailand and Indonesia, which supports assembly and quality inspection processes, driving the digital transformation (DX) of manufacturing sites on November 25, 2025. The system combines projector-based task guidance with image sensing technologies to help create manufacturing...
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18.11.2025
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OKI Develops High-Accuracy Simulation Technology for High-Frequency Vias for 1.6 Tbps-class High-Speed Transmission PCBs to Support Next-Generation AI Data Centers
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The OKI Group’s PCB business company OKI Circuit Technology (OTC; President: Masaya Suzuki, Head office: Tsuruoka City, Yamagata) has successfully developed High-Accuracy Simulation Technology for High-Frequency Vias that enables precise control of via (Note 1) characteristics in 1.6 Tbps-class high-speed transmission PCBs that support next-genera...
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29.09.2025
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OKI Partners with Lipi Data Systems Ltd to Begin Local Production of ATMs for the Indian Market
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OKI (TOKYO: 6703) has entered into a partnership agreement with Lipi Data Systems Ltd (HQ: Mumbai, India) and has commenced local production of ATMs for major financial institutions in India on September 16, 2025. OKI will gradually expand its production capacity and strengthen its production system for the Indian market. Production will start at...
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20.10.2025
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08.09.2025
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OKI Signed Memorandum of Understanding with Turkish State Railways for the Proof of Concept Using Zero Energy IoT Series IoT Disaster Prevention Inspection and Monitoring Technology
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OKI (TOKYO: 6703) has signed a Memorandum of Understanding (MOU) with the Turkish State Railways (Head office: Ankara Province, Türkiye; “TCDD”) to conduct a Proof of Concept involving emergency notifications using IoT disaster prevention inspection and monitoring technology - "Zero Energy IoT Series," as well as disaster risk prediction utilizing...
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20.10.2025
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14.08.2025
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OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
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OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute t...
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28.07.2025
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OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
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OKI Circuit Technology (President: Masaya Suzuki, Head office: Tsuruoka, Yamagata Prefecture, “OTC” hereinafter), the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environm...
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23.07.2025
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OKI Becomes First Japanese Company to Acquire ISO 56001 International Standard for Innovation Management Systems
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OKI (TOKYO: 6703) became the first company in Japan to acquire the British Standards Institution (BSI) KitemarkTM (Note 1) certification, in accordance with the new ISO 56001 (Note 2) international standard for innovation management systems (IMS) on July 8, 2025. Launched in 2017, OKI’s Yume Pro innovation management system is the first in Japan t...
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07.07.2025
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OKI Launches Small-Lot Custom Long FPCs for the New Space Industry
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OKI Electric Cable (President: Hideo Yamaguchi; Headquarters: Isesaki City, Gunma Prefecture; “OEC” hereinafter), the OKI Group’s electric cable business company, will launch the sale of small-lot custom long flexible printed circuits (FPCs) for use in equipment mounted on rockets and satellites for the New Space industry on July 8, 2025. The prod...
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20.06.2025
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OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
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OKI (TOKYO: 6703) , in collaboration with NTT Innovative Devices Corporation (Headquarters: Kanagawa Prefecture; President & CEO: Hidehiro Tsukano; “NTT Innovative Devices” hereinafter), has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) (Note 1) technology for heterogeneous material bo...
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02.06.2025
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OKI Establishes OKI Berlin Lab R&D Center in Berlin, Germany
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OKI (TOKYO: 6703) established the OKI Berlin Lab research and development center in Berlin, Germany on June 1, 2025. The establishment of this new center is intended to strengthen photonics technology, one of OKI’s core technologies, to a world-class level as part of OKI’s Technology Strategy, while helping to resolve emerging social issues throug...
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07.05.2025
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OKI to Exhibit Motion-tolerant FA Cables and FPCs at AUTOMATE 2025 in the USA
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OKI Electric Cable (President: Hideo Yamaguchi; Head office: Isesaki City, Gunma Prefecture), the OKI Group electric cable company, will exhibit at AUTOMATE 2025, an event to be held in Detroit, Michigan, USA, from May 12 to 15, 2025, with the aim of acquiring new customers and expanding sales. The company will showcase its motion-tolerant and fle...
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25.04.2025
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OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
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OKI Circuit Technology (“OTC”; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM (Note 1) mounted on AI semiconductors. This is a roughl...
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20.10.2025
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22.04.2025
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OKI Group’s Greenhouse Gas Emission Reduction Targets Acquire SBT Net Zero Standards Certification
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OKI (TOKYO: 6703) has acquired SBT certification for its FY2050 greenhouse gas emission reduction targets, which are among its mid- to long-term environmental targets: OKI Group Environmental Vision 2030/2050. These targets have been recognized as science-based by the international Science Based Targets initiative (SBTi) (Note 1), to achieve the 1...
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21.04.2025
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OKI Invests in ICMG Co-Creation Fund II Limited Partnership
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OKI (TOKYO: 6703) has entered into an agreement for investment in the ICMG Co-Creation Fund II Limited Partnership (“ICMG Co-Creation Fund II” hereinafter), newly established by the ICMG Group (Head office: Chiyoda-ku, Tokyo; Group COO: Gen Funahashi) in January 2025. Managed by ICMG Ventures Pte. Ltd., an ICMG Group investment management company...
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25.03.2025
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OKI Publishes Technical Journal Featuring “Innovations utilizing Edge Platforms”
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OKI (TOKYO: 6703) today published an English edition of OKI Technical Review (Note 1), Issue 243. The theme of this issue’s special feature is “Innovations utilizing Edge Platforms.” The coverage introduces specific examples of technologies and solutions suited to the field to address a wide range of social issues.
OKI has announced the concept o...
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04.02.2025
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OKI Launches SHO-XYZ Location and Inventory Management System to Easily Track Products, Equipment, and Other Items Stored Indoors and Outdoors From a Smartphone
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OKI (TOKYO:6703) will launch its SHO-XYZTM (pronounced “sho-zai”) location and inventory management system in the Japanese market from March 2025, for easy tracking of products, equipment, and other items stored indoors and outdoors from a smartphone. This system allows the centralized management of storage locations and inventory information via...
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28.01.2025
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OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
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OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of thin-film analog ICs (Note 2) using Crystal Film Bonding (CFB) technology (Note 3). This technology is applicable to heterogeneous integration (Note 4), wh...
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27.01.2025
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OKI Develops ‘Ship Classification AI System Technology’ to Classify Ships Through Deep Learning of Underwater Sounds
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OKI (TOKYO: 6703) has developed ‘ship classification AI system technology’ for the automatic classification of ship types through deep learning of underwater sounds. This technology makes it possible to continuously and automatically acquire ship classification data, even in environments such as busy ports with high ship traffic and at night, when...
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14.01.2025
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OKI Develops Machine Vision Interface Cable with FAKRA Connector for Robots and Industrial FA Equipment
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OKI Electric Cable (President: Hideo Yamaguchi, Head office: Isesaki, Gunma Prefecture), the OKI Group’s electric cable company, has developed a coaxial cable with a FAKRA (Note 1) connector for use as an interface cable for machine vision systems (Note 2) such as image inspection equipment. Targeting robots and the industrial FA industry, OKI Ele...
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26.12.2024
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OKI and FPT Announce Capital and Business Alliance to Strengthen Global Strategic Partnership
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OKI (TOKYO: 6703) has entered a strategic partnership with global technology corporation FPT, through its subsidiary FPT Japan, agreeing partial ownership of OKI’s two software development subsidiaries in China. The collaboration is set to accelerate software development capabilities and drive global business expansion for both companies.
This pr...
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11.12.2024
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OKI Develops Printed Circuit Board Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
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The OKI Group printed circuit board (PCB) business company OKI Circuit Technology (President: Masaya Suzuki; Headquarters: Tsuruoka City, Yamagata Prefecture; “OTC” hereinafter) has successfully developed multi-layer PCB technology with stepped copper coin insertion (“stepped copper coin” hereinafter) to achieve 55 times better heat dissipation co...
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13.11.2024
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OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
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Using silicon photonics technology for semiconductor optical circuits, OKI (TOKYO: 6703) has successfully developed an ultracompact photonic integrated circuit chip with a broad range of potential applications, including optical fiber sensors, laser vibrometers, and optical biosensors. This makes it possible to achieve ultra-miniaturization and lo...
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22.10.2024
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OKI Receives Order to Produce Units for Astroscale
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OKI (TOKYO: 6703) recently received an order to produce units for satellites developed by Astroscale Japan Inc. (“Astroscale Japan”), a subsidiary of Astroscale Holdings Inc. (“Astroscale”), a market leader in satellite servicing and long-term orbital sustainability across all orbits. After evaluating evaluation samples and test samples, OKI will...
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10.10.2024
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OKI Collaborates with 27pilots to Promptly Provide Solutions to Social Issues Using Venture Client Model
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OKI (TOKYO: 6703) is adopting the venture client model (“VCM”), which is currently gaining traction in Europe and the US, to promptly provide solutions to increasingly complex social issues—an approach taken as part of OKI’s efforts to rapidly incorporate leading global technologies into its business operations. Having established processes and an...
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30.09.2024
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OKI to Exhibit High-Reliability Printed Circuit Boards for Aerospace, Defense, and Telecommunications at PCB West 2024 in USA
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OKI (TOKYO:6703) today announced that the OKI Group’s printed circuit board (PCB) company OKI Circuit Technology (“OTC”; President: Masaya Suzuki, Headquarters: Tsuruoka, Yamagata Prefecture) will participate in the PCB West 2024 Conference & Exhibition (“PCB West”), scheduled to take place from October 8 to 11 in Silicon Valley, USA. OTC will...
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19.08.2024
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OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
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The OKI Group PCB business company OKI Circuit Technology (President: Masaya Suzuki, Headquarters: Tsuruoka City, Yamagata Prefecture) has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July. The PCBs produced are incorporated into equipment for manufactu...
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